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POLYFUSE ? Resettable PTCs
Surface Mount > 2016L Series
Soldering Parameters
Condition
Peak Temp/ Duration Time
Re?ow
260°C / 10 Sec
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
60 Sec ~ 100 Sec
50 Sec ~ 150 Sec
0°C~35°C, =70%RH
260
220
Preheating
Soldering
Cooling
180
oven, N 2 environment for lead–free
120
solvents.
Note: If re?ow temperatures exceed the recommended pro?le,
0
50 to 150
60 to 100
120
devices may not meet the performance requirements.
Physical Speci?cations
Time(s)
Environmental Speci?cations
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Meets EIA Speci?cation RS186-9E, ANSI/
J-STD-002 Category 3.
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
Humidity Aging
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
MIL–STD–202, Method 107G
Thermal Shock
Solvent Resistance
Vibration
Moisture Sensitivity Level
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202, Method 215
No change
MIL–STD–883C, Method 2007.1,
Condition A
No change
Level 1, J–STD–020C
? 2010 Littelfuse, Inc
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
47
Revised: July 12, 2010
2016L Series
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